Angebot 103 von 185 vom 12.05.2023, 15:47


Bark­hau­sen Insti­tut gGmbH - Inter­net der Dinge

The Bark­hau­sen Insti­tute per­forms rese­arch on the latest hard­ware, soft­ware and com­mu­nic­a­tion tech­no­lo­gies and demon­stra­tes their app­lic­a­tion in tomor­row's soci­ety. Our goal is to build a flex­ible and trust­worthy IoT plat­form based on reli­able elec­tron­ics and secure com­mu­nic­a­tion meth­ods.

Stu­dent Assist­ant – Radio Fre­quency Prin­ted Cir­cuit Boards Design, Fab­ric­a­tion & Meas­ure­ment (m/f/d)

Working field:

The RF Design Enable­ment group rese­ar­ches and devel­ops depend­able IoT sys­tems with focus on three key rese­arch top­ics such as joint radar-com­mu­nic­a­tion sys­tem, antenna-sys­tem design with meta-sur­face and phys­ical layer secur­ity. We focus our rese­arch on design­ing build­ing blocks, while identi­fy­ing crit­ical hard­ware para­met­ers for next-gen­er­a­tion hard­ware sys­tems and app­lic­a­tions.

The pro­ject
The SHK will design app­lic­a­tion spe­cific radio fre­quency elec­tro­nic mod­ules using a com­bin­a­tion of simple pla­nar RF-com­pon­ents and off-the-shelf sur­face mount blocks. The SHK will man­u­fac­ture the boards with our in-house man­u­fac­tur­ing facil­ity or through third party man­u­fac­tur­ers and assem­ble the boards for meas­ure­ment.

Your tasks
  • Design­ing and sim­u­lat­ing simple pla­nar RF-com­pon­ents (e.g., hybrid coup­lers) using EM sim­u­la­tion soft­ware (AWR, HFSS, etc.)
  • Mul­tilayer PCB designs with tailor-made RF and off-the-shelf SMT com­pon­ents using soft­ware tools (e.g., Altium desi­gner, KiCAD, etc.)
  • Man­u­fac­tur­ing of the boards using LPKF machine or third-party man­u­fac­tur­ing ser­vices
  • Assem­bling of the boards with SMDs
  • App­lic­a­tion spe­cific meas­ure­ments of the boards


We expect the fol­low­ing
  • Study of elec­tri­cal/elec­tron­ics engin­eer­ing, com­puter sci­ence or com­par­able
  • Basic know­ledge of micro­wave engin­eer­ing and wire­less com­mu­nic­a­tions the­ory
  • Know­ledge of EM soft­ware (AWR, HFSS, CST etc)
  • Prior exper­i­ence of PCB design­ing with SMT com­pon­ent
  • Prior exper­i­ence of using RF meas­ure­ment equip­ment pre­fer­red
  • Good com­mu­nic­a­tion and writ­ing skills in Eng­lish

What we offer:

What we pro­vide
  • An open and cre­at­ive team of enthu­si­astic sci­ent­ists
  • Close to cam­pus
  • Agile work­ing hours and work­flows
  • Work on future tech­no­lo­gies

If you have pas­sion for new tech­no­lo­gies and the desire to deve­lop the con­nec­ted world of tomor­row with us, we are look­ing for you.

Life and sci­ence are com­pat­ible at our insti­tute. We offer a range of recog­nised fam­ily-fri­endly meas­ures, such as part-time work, mobile work­ing and flex­ible work­ing hours that take fam­ily needs into account. We also offer sup­port for arriv­ing in Dres­den (all form­al­it­ies, apart­ment etc.).

How to apply:

App­lic­a­tion pro­ced­ure

Short let­ter of motiv­a­tion and cur­ricu­lum vitae to We only accept com­plete doc­u­ments as one sin­gle PDF doc­u­ment by e-mail. App­lic­a­tions that con­tain other file for­mats (e.g. Word, Excel) will not be con­side­red in the selec­tion pro­cess. Infor­mal inquir­ies can also be sub­mit­ted to the same address.

The data sub­mit­ted by you in the course of the app­lic­a­tion pro­ced­ure will be pro­ces­sed by the Bark­hau­sen Insti­tut (BI). BI shall use the data for the pur­poses of the app­lic­a­tion pro­ced­ure. No data shall be pas­sed on to third par­ties.