Fraunhofer-Institut für Organische Elektronik, Elektronenstrahl- und Plasmatechnik FEP
The Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP is located in Dresden and focuses on developing innovative solutions, technologies and processes for surface modification and organic electronics. For the development of solutions for various industrial tasks in surface treatment, vacuum coating and for organic semiconductors we use our core competencies in electron beam technology, roll-to-roll technology, plasma-activated large-area and precision coating, technologies for organic electronics, IC design and the development of technological key components.
The department IC and System design at Fraunhofer FEP works on the design of application specific integrated circuits (ASIC). These are mostly microdisplays with integrated sensors, which are used in the emerging markets of augmented and virtual reality, but could also be used in pure sensor applications. Our bidirectional microdisplay for example, which comines camera and displays functionality in one device – can be used to detect fingerprints in a very high spatial resolution. But we also doing reserach in the field of botany and medicine.
VHDL, VERILOG, FPGA AND IMAGE PROCESSING ARE YOUR TOPIC?
To support our team, we are looking for students who are interested in an internship or a position as a student assistant at our Location Maria-Reiche-Str. in Dresden-Klotzsche as soon as possible.