Working field:
After the chemical mechanical polishing (CMP) of copper interconnect on 300mm wafers, organic residues are critical for the process yield. To enable a dedicated particle removal approach, the surface properties as well as the interaction between particles and wafer surface need to be understood.
For this investigation wafers coated with different dielectric materials will be processed by CMP. Lab studies by different surface analysis techniques will be performed e. g. surface potential measurement, cp-AFM, XPS, etc.
These tasks can be worked on as part of a bachelor, master or diploma thesis.
Requirements:
What we offer:
The weekly working time is 39 hours. This position is also available on a part-time basis. We value and promote the diversity of our employees' skills and therefore welcome all applications - regardless of age, gender, nationality, ethnic and social origin, religion, ideology, disability, sexual orientation and identity. Severely disabled persons are given preference in the event of equal suitability.
With its focus on developing key technologies that are vital for the future and enabling the commercial utilization of this work by business and industry, Fraunhofer plays a central role in the innovation process. As a pioneer and catalyst for groundbreaking developments and scientific excellence, Fraunhofer helps shape society now and in the future.
Interested? Apply online now with your significant application documents, transcript of records and enrollment certificate . We look forward to getting to know you!
Contact
Mrs. Sabrina Weimert
Human Resources
Phone: +49 (0)351 8823 415
Mrs. Haosheng Wu
Specialty Department
Phone: +49 (0)351 2607 3244